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This handbook will provide engineers with the principles, applications, and solutions needed to design and manage semiconductor manufacturing operations. Consolidating the many complex fields of semiconductor fundamentals and manufacturing into one volume by deploying a team of world class specialists, it allows the quick look up of specific manufacturing reference data across many subdisciplines.

From the Back Cover

WORLD-CLASS SEMICONDUCTOR MANUFACTURING EXPERTISE AT YOUR FINGERTIPS

This is a comprehensive reference to the semiconductor manufacturing process and ancillary facilities -- from raw material preparation to packaging and testing, applying basics to emerging technologies. Readers charged with optimizing the design and performance of manufacturing processes will find all the information necessary to produce the highest quality chips at the lowest price in the shortest time possible. The Semiconductor Manufacturing Handbook provides leading-edge information on semiconductor wafer processes, MEMS, nanotechnology, and FPD, plus the latest manufacturing and automation technologies, including: 

Yield Management 

Automated Material Handling System 

Fab and Cleanroom Design and Operation 

Gas Abatement and Waste Treatment Management 

And much more

Written by 60 international experts, and peer reviewed by a seasoned advisory board, this handbook covers the fundamentals of relevant technology and its real-life application and operational considerations for planning, implementing, and controlling manufacturing processes. It includes hundreds of detailed illustrations and a list of relevant books, technical papers, and websites for further research. This inclusive, wide-ranging coverage makes the Semiconductor Manufacturing Handbook the most comprehensive single-volume reference ever published in the field. 

STATE-OF-THE-ART SEMICONDUCTOR TECHNOLOGIES AND MANUFACTURING PROCESSES: 

SEMICONDUCTOR FUNDAMENTALS
How Chips Are Designed and Made * Substrates * Copper and Low-k Dielectrics * Silicide Formation * Plasma * Vacuum * Photomask
WAFER PROCESSING TECHNOLOGIES
Microlithography * Ion Implantation * Etch * PVD/ALD * CVD * ECD * Epitaxy * CMP * Wet Cleaning
FINAL MANUFACTURING
Packaging * Grinding, Stress Relief, Dicing * Inspection, Measurement, and Testing
NANOTECHNOLOGY, MEMS, AND FPD GAS AND CHEMICALS
Specialty Gas System and DCA * Gas Abatement Systems * Chemical and Slurries Delivery System * Ultra Pure Water
FAB YIELD, OPERATIONS, AND FACILITIES
Yield Management * Automated Materials Handling System * Metrology * Six Sigma * Advanced Process Control * EHS * Fab Design and Construction * Cleanroom * Vibration and Acoustic Control * ESD * Airborne Molecular Control * Particle Monitoring * Wastewater Neutralization Systems

About the Author

Hwaiyu Geng, CMfgE, P.E. (Palo Alto, California) is a Project Manager of Corporate REWS at Hewlett-Packard Company. His experience in manufacturing engineering is diverse, including work at Applied Materials and Hewlett-Packard’s high-tech industries. He has faced many of the challenges facing engineers today, having designed manufacturing processes and facilities for new products, implemented automated manufacturing systems, and established quality, safety, and maintenance programs. He is a Certified Manufacturing Engineer by the Society of Manufacturing Engineers and a Professional Engineer in the State of California. Mr. Geng is also the author of McGraw-Hill's Manufacturing Engineering Handbook.